| PART |
Description |
Maker |
| CYM6001K-25 |
32-BIT, 25 MHz, MICROPROCESSOR, XMA 5.780 X 3.300 INCH, HEAT SINK, SURFACE MOUNT PACKAGE
|
Cypress Semiconductor, Corp.
|
| 37717-1001 37717-0001 |
CoolFin Heat Sink with Integrated Heat Pipes
|
Molex Electronics Ltd.
|
| 528-45AB |
Heat Sink; Package/Case:Half Brick; Body Material:Aluminum; Thermal Resistance:3.2 C/W; Color:Black; Size/Dimensions:0.450H x 2.240W x 2.280L"
|
Wakefield Thermal Solutions
|
| ATS-55210R-C1-R0 |
High Performance X-CUT - Heat Sink, T412, BLACK-ANODIZED
High Perfomance X-CUT - Heat Sink, T412, BLACK-ANODIZED
|
Advanced Analog Technology, Inc.
Advanced Thermal Solutions, Inc.
|
| ATS-19G-116-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| CPC1968 |
5A Load Current with 5C/W Heat Sink
|
IXYS Corporation
|
| 1489948-2 |
HEAT SINK CLIP XFP
|
Tyco Electronics
|
| LPD35-20B LPD35-35B LPD35-5B LPD35-10B LPD35-3B LP |
Low Pressure Drop Heat Sink
|
ALPHA
|
| LPD60-7B LPD60-30B LPD60-10B LPD60-8B LPD60-20B LP |
Low Pressure Drop Heat Sink
|
ALPHA
|
| LPD54-6B LPD54-30B LPD54-35B LPD54-9B LPD54-8B LPD |
Low Pressure Drop Heat Sink
|
ALPHA
|
